前言：Cho-Bond 584-29
CHO-BOND 584-29是一种双组分，银填充导电环氧粘合剂系统，设计用于必须实现强，高导电性电气连接的应用
CHO-BOND 584-29 is a two-component, silver filled conductive epoxy adhesive system designed for applications where a strong, highly conductive electrical bond must be achieved